Description 

Our femtosecond laser platform is a key element of our fabrication workflow, directly connected to the cleanroom environment. More than a high-precision tool, it serves as a versatile interface between design and prototyping, enabling us to move seamlessly from microfabrication to functional devices.

We use the system to cut electrode contours with micrometer accuracy, to dice wafers cleanly and efficiently, and to perform a wide range of ultrafast laser applications such as surface structuring, patterning, and selective material removal. The femtosecond regime allows us to process delicate materials without thermal damage, preserving both the integrity and performance of sensitive devices.

Thanks to its seamless integration and intuitive software environment, the platform accelerates development cycles, opening the door to rapid prototyping, novel device architectures, and advanced surface engineering—all within a single, flexible system.

Main Characteristics 

– Motorized X,Y,Z axis / 1 µm stage resolution

– Working area : 200x200mm (XY), 100mm (Z)

– Carbide CB5 femto laser source

– Maximum Output power : 6W

– Tunable pulse duration, 290 fs – 20 ps

– Single-shot – 1 MHz repetition rate

– Integrated CAD software

Key Applications

• Laser Micro Drilling & Cutting – High-precision geometries in a wide variety of materials.

• Laser Patterning – Fine, reproducible structures for micro-electronics and photonics.

• Laser Surface Treatment – Selective modification of surface properties (adhesion, wettability, reflectivity, etc.).

• Laser Surface Structuring – Functional topographies for biomedical, optical, and tribological applications.

• Laser Wire Stripping – Selective and damage-free removal of wire insulation.